Light emitting device and method for manufacturing the same

ABSTRACT

A light emitting device includes a light emitting element having an upper face and lateral faces; a light transmissive member covering at least a portion of the upper face of the light emitting element and transmitting light emitted from the light emitting element; a first reflector covering at least a portion of lateral faces of the light transmissive member; and a second reflector covering the lateral faces of the light emitting element. The first reflector includes a first bottom face and a second bottom face. A plane in which the first bottom face of the first reflector extends is different than a plane in which a lower face of the light transmissive member extends. The second bottom face of the first reflector is located inward of the first bottom face of the first reflector, and is coplanar with the lower face of the light transmissive member. The first bottom face of the first reflector is covered by and in contact with the second reflector.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims priority under 35 U. S. C. §119 toJapanese Patent Application No. 2015-111516, filed Jun. 1, 2015. Thecontents of this application are incorporated herein by reference intheir entirety.

BACKGROUND

The present disclosure relates to light emitting devices and methods forproducing the same.

Surface mount type light emitting devices using a package for housing alight emitting element have been widely used. Since a surface mount typelight emitting device is prepared by mounting a light emitting clementin a separately prepared package, the extent of size reduction has beenrestricted by the package size. Accordingly, light emitting devices inwhich the lateral faces of a light emitting element are covered by areflector, in lieu of a package, have been proposed (see, for example,Japanese Unexamined Patent Application Publication No. 2012-227470 (“JP'470”)).

SUMMARY

A light emitting device according to one embodiment of the inventionincludes a light emitting element having an upper face and lateralfaces; a light transmissive member covering at least a portion of theupper face of the light emitting element and transmitting the lightemitted from the light emitting element; a first reflector retaining thelight transmissive member; and a second reflector covering the lateralfaces of the light emitting element, wherein the first reflector has abottom face positioned on a different plane from the lower face of thelight transmissive member, and the bottom face is in contact with thesecond reflector.

A method for producing the light emitting device according to oneembodiment of the invention is a method for producing the light emittingdevice having a light emitting element, a light transmissive membercovering at least a portion of the upper face of the light emittingelement, a first reflector disposed to surround the light transmissivemember, and a second reflector covering the lateral faces of the lightemitting element. The method includes a baseplate preparation step forpreparing a baseplate having a plate surface on which a protrusion isprovided in the area corresponding to the position where the lightemitting element will be disposed; a first resin frame forming step forforming on the plate surface a first resin frame for the first reflectorhaving an opening on the protrusion; a second resin coating step forfilling the opening with a second resin for the light transmissivemember; a baseplate detaching step for detaching the baseplate; a lightemitting element bonding step for bonding the light emitting element tothe second resin surface exposed as a result of detaching the baseplate;and a third resin coating step for applying a third resin for the secondreflector which surrounds the lateral faces of the light emittingelement and is in contact with the first resin layer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic top view of the light emitting device according toEmbodiment 1.

FIG. 2 is a schematic sectional view along line A-A′ indicated in FIG.1.

FIG. 3 is a schematic bottom view of the light emitting device accordingto Embodiment 1.

FIG. 4 is a schematic top view of the light emitting device according toEmbodiment 2.

FIG. 5 is a schematic sectional view along line A-A′ indicated in FIG.4.

FIG. 6 is a schematic bottom view of the light emitting device accordingto Embodiment 2.

FIGS. 7A-7G are schematic sectional views explaining the manufacturingmethod for the light emitting device according to Embodiment 1.

FIGS. 8A and 8B are schematic sectional views explaining themanufacturing method for a variation of the light emitting device ofEmbodiment 1.

FIG. 9 is a schematic sectional view of the light emitting deviceaccording to Embodiment 3.

FIGS. 10A-10G are schematic sectional views explaining the manufacturingmethod for the light emitting device according to Embodiment 4.

FIG. 11 is a schematic sectional view of the light emitting device ofEmbodiment 4.

DESCRIPTION

Embodiments of the present invention will be explained in detail belowbased on drawings. In the explanations below, terms indicating certaindirections and positions will be used as needed (for example, “upper,”“lower,” “right,” “left,” and other terms including these). These termsare used for the purpose of making the invention easily understood basedon the drawings being referred to, and the technical scope of theinvention should not be limited by the meanings of these terms. Theportions denoted by the same reference numerals appearing in multipledrawings represent the same portions or components.

In the light emitting device disclosed in JP '470, the lateral faces ofthe phosphor sheet are not covered by the reflector, and thus exposed,once the light emitting devices are separated into individual pieces.Thus, the outline of the light emitting portion is blurred, resulting inpoor visibility (that is, there is no clear distinction between thelight emitting portion and the non-emitting portion).

Accordingly, an object of certain embodiments of the invention is toprovide a light emitting device having a clearly defined light emittingportion and a method for producing the same.

According to the light emitting device and the production methodaccording to the embodiments of the invention described above, a lightemitting device having a clearly defined light emitting portion and amethod for producing the same can be provided.

Light Emitting Device According to Embodiment 1

FIG. 1 is a schematic top view of the light emitting device according toEmbodiment 1 of the present invention, FIG. 2 is a schematic sectionalview along line A-A′ indicated in FIG. 1, and FIG. 3 is a schematicbottom view of the light emitting device according to Embodiment 1.

The light emitting device according to Embodiment 1 includes: a lightemitting element 1 which has an upper face as the emission face andelectrodes 13 and 14 disposed on its lower face opposite the emissionface; a light transmissive member 3 disposed on the emission face of thelight emitting element 1; a first reflector 5 disposed to surround thelight transmissive member 3; and a second reflector 7 disposed tosurround the light emitting element 1.

In the light emitting device according to Embodiment 1, the lightemitting element 1 includes, for example, a light transmittive substrate12 positioned on the emission face side, and a semiconductor stack 11disposed on the face of the light transmittive substrate 12 opposite theemission face, wherein the electrodes 13 and 14 are formed on thesurface of the semiconductor stack 11. The semiconductor stack 11includes, for example, an n-type semiconductor layer and a p-typesemiconductor layer wherein the electrode 13 is connected to one of then-type semiconductor layer and the p-type semiconductor layer, and theelectrode 14 is connected to the other of the n-type semiconductor layerand the p-type semiconductor layer. The semiconductor stack 11 mayfurther include an emission layer between the n-type semiconductor layerand the p-type semiconductor layer.

In the light emitting device according to Embodiment 1, the lighttransmissive member 3 is disposed so that its lower lace opposes theemission face of the light emitting element 1 to cover at least aportion of the emission face of the light emitting clement 1, and thelight emitted by the light emitting element is ejected after passingthrough the light transmissive member 3. In the light emitting device ofEmbodiment 1, the light transmissive member 3 is preferably disposed tocover substantially the entire emission face of the light emittingelement 1, more preferably disposed, as shown in FIG. 1, so as to coverthe entire emission face of the light emitting element I, and its outercircumferential faces (outer lateral faces) are positioned outside theouter lateral faces of the light emitting element 1. The surface 3 s,which is the upper face of the light transmissive member 3, makes up aportion of the upper face of the light emitting device as the lightejecting face. The light transmissive member 3 may contain a wavelengthconverting substance for converting the light emitted by the lightemitting element 1 into light having a different wavelength.

In the light emitting device of Embodiment 1, the first reflector 5 isdisposed to surround the light transmissive member 3, preferably incontact with the light transmissive member 3 to reduce light leakagefrom the lateral faces of the light transmissive member 3 and retain thelight transmissive member 3. The first reflector 5 is preferablydisposed in contact with the entire lateral faces of the lighttransmissive member 3, thereby effectively reducing light leakage fromthe lateral faces of the light transmissive member 3 and securelyretaining the light transmissive member 3.

In the light emitting device according to Embodiment 1, the boundarybetween the light ejecting face made of the surface 3 s and thenon-ejecting face made of the surface 5 s at the upper face of the lightemitting device can be defined clearly by the surface 5 s of the firstreflector 5, for example, makes up a portion of the upper face of thelight emitting device by surrounding the surface 3 s which is the upperface of the light transmitting member 3.

Moreover, the first reflector 5 has a first bottom face 5 a positionedlower than the lower face of the light transmissive member 3, creating adifference in level with the second bottom face 5 b which issubstantially coplanar with the lower face of the light transmissivemember 3, such as that shown in FIG. 2. In the light emitting device ofEmbodiment 1, the lower face of the light transmissive member 3 and thesecond bottom face 5 b, which are substantially coplanar, form themounting face for mounting the light emitting element 1, and theemission face of the light emitting element I is bonded to the mountingface by a die bonding resin so as to oppose the lower face of the lighttransmissive member 3. This can form a die bonding resin on the insideof the inner circumferential faces 5 c of the first reflector 5, whichare positioned between the first bottom face 5 a and the second bottomface 5 b, along the lateral faces of the light emitting element 1. Thedie bonding resin has oblique portions 9 as its oblique lateral facesspread out from the lateral faces of the light emitting element 1towards the light transmissive member 3. The die bonding resinpreferably is a light transmissive resin because light needs to transmitthrough the die bonding resin formed between the light emitting elementI and the light transmissive member 3. The light transmissive resinlayer formed between the light emitting element 1 and the lighttransmissive member 3 is formed to a thickness, for example, in a rangebetween about 2 μm and about 30 μm, preferably in a range between about4 μm and about 20 μm, more preferably in a range between about 5 μm andabout 10 μm. Here, the oblique portions 9 are formed with the diebonding resin, but the oblique portions 9 may be formed using anotherlight transmissive resin separate from the die bonding resin.

In the light emitting device according to Embodiment 1, the secondreflector 7 is disposed to cover the light emitting element 1, andsurfaces of the electrodes 13 and 14 are exposed for external connectionof the light emitting device. The second reflector 7 is disposed so asto cover and be in contact with the first bottom face 5 a of the firstreflector 5, and the light emitting element 1 is protected by both thesecond reflector 7 and the first reflector 5. The second reflector 7 ispreferably formed in contact with the portion of the first reflector 5having the difference in level, i.e., the inner circumferential faces ofthe first reflector 5 and a surface of the die bonding resin, inaddition to the first bottom face 5 a of the first reflector 5. This canenhance the bonding strength between the first reflector 5 and thesecond reflector 7. When the oblique portions 9 are formed with a lighttransmissive resin, the light ejected from the lateral faces of thelight emitting element 1 can be reflected at the interfaces between theoblique portions 9 and the second reflector 7 to be extracted throughthe light transmissive member 3, thereby increasing the light extractionefficiency. The bottom face of the second reflector 7 is formedsubstantially flat, and the surfaces of the electrodes 13 and 14 areexposed at the bottom face. In the light emitting device of Embodiment1, the bottom face of the second reflector 7, where the surfaces of theelectrodes 13 and 14 are exposed, serves as the mounting face of thelight emitting device.

The light emitting device of Embodiment 1 described above can be madecompact as it is structured to protect the light emitting element 1 withthe second reflector 7 and the first reflector 5 without employing aseparately prepared package.

The light emitting device of Embodiment 1 described above can configurethe surface 5 s of the first reflector 5 to surround the surface 3 c ofthe light transmissive member 3, which is the light ejecting face,thereby clearly defining the boundary between the light ejecting faceand the non-ejecting face to provide a light emitting device with goodvisibility.

The light emitting device of Embodiment 1 described above caneffectively reduce light leakage from the interface between the firstreflector 5 and the second reflector 7 because a difference in level iscreated between the first bottom face 5 a and the second bottom face 5 bof the first reflection member 5.

Here, the difference in level created between the first bottom face 5 aand the second bottom face 5 b is preferably in a range between about 1μm and about 1000 μm, more preferably in a range between about 10 μm andabout 200 μm, yet more preferably in a range between about 30 μm andabout 100 μm, in order to enhance the bonding strength between the firstreflector 5 and the second reflector 7, and effectively reduce lightleakage from the interface between the first reflector 5 and the secondreflector 7. In other words, the difference in level created between thefirst bottom face 5 a and the second bottom face 5 b represents theheight of the inner circumferential faces 5 c.

The thickness of the light transmissive member 3, moreover, ispreferably in a range between about 10 μm and about 500 μm. Thethickness of the first reflector 5 where there is no difference in level(that is, the thinner portion) is preferably substantially the same asthe thickness of the light transmissive member 3, i.e., in a rangebetween about 10 μm and about 500 μm. This can construct a lightemitting device having even better visibility.

With respect to the light emitting device of Embodiment 1 describedabove, FIG. 2 shows an example in which the light transmissive member 3has a flat surface 3 s, which is the light ejecting face. However, thelight emitting device is not limited to those having a flat lightejecting face, and may have a concave or convex surface. The lightejecting face may also be an irregular surface.

The light emitting device of Embodiment 1 constructed as above can bemanufactured by the manufacturing method described below, and thus canbe manufactured inexpensively.

The light emitting device of Embodiment 1 constructed as above can bemanufactured by the manufacturing method described below. Thus, byallowing the light transmissive member 3 to contain a phosphor, lightemitting devices containing various phosphors can be produced.

Manufacturing Method for the Light Emitting Device According toEmbodiment 1

The method for producing the light emitting device according toEmbodiment 1 includes a preparing baseplate, forming a first reflector,forming a light transmissive member, mounting a light emitting element,forming a second reflector, and dicing (separating). In thismanufacturing method, forming first reflector and forming lighttransmissive member are performed on the baseplate 20 prepared by thebaseplate preparation step.

Preparing Baseplate

In the manufacturing method of Embodiment 1, in the baseplatepreparation step, a baseplate 20 having protrusions 21 a in the areascorresponding to the positions at which light emitting elements will bedisposed is prepared. The protrusions 21 a are formed on a plate surface21 of the baseplate 20. The baseplate 20, for example, is made of ametal, such as SUS, and the protrusions 21 a are formed by machining theplate surface. The shape of the protrusion 21 a is determined based onthe shape of the light emitting element 1, and for example, the upperface of the protrusion is formed slightly larger than the upper faceshape of the light emitting element 1 for easily mounting the lightemitting element 1.

The baseplate can be used repeatedly, and thus the baseplate preparationstep is not something that is always required before the first reflectorforming step.

Forming First Reflector

In the manufacturing method of Embodiment 2, in the first reflectorforming step, as shown in FIG. 7A for example, a mold 250 is placed onthe plate surface 21 side of the baseplate 20, and the first resinframes 25 b each having an opening above the protrusion 21 a are formedin a lattice pattern by transfer molding, injection molding, or thelike. More specifically, a mold 250 having mold protrusions 250 alocated in correspondence with the protrusions 21 a of the base plate 20is placed so as to bring the upper faces of the mold protrusions 250 ainto contact with the upper faces of the protrusions 21 a to createcavities having a matching shape to the first resin frame 25 a at theperiphery of the protrusions 21 and the mold protrusions 250 a. Thecavities are filled with a first resin containing a light reflectingsubstance, for example, and then cured. In this way, the first resinframes 25 b are formed which will become the first reflectors 5 whenseparated into individual light emitting devices.

The first reflector forming step may be adapted to form and cure thefirst resin layer 25 on the entire baseplate surface 21 without using amold 250, as shown in FIG. 8A, followed by forming the openings (openingforming step), as shown in FIG. 8B. In the opening forming step, anopening 25 a is formed in the cured first resin layer 25 above eachprotrusion 21 a. The openings 25 a are formed to expose the protrusions21 a at the bottom of the openings 25 a and to the shape correspondingto the light transmissive members 3.

The openings 25 a can be formed by, for example, blasting, lasing, orthe like.

Forming Light Transmissive Member

In the manufacturing method of Embodiment 1, the light transmissivemember forming step, if forming a phosphor-containing light transmissivemember 3, for example, includes a second resin layer forming step, aphosphor sedimentation step for settling the phosphor by, for example,centrifugation, and a second resin layer curing step.

In the second resin layer forming step, as shown in FIG. 7C, the secondresin layer 23 is formed by applying, for example, a phosphor-containingsecond resin so as to fill the openings 25 a and cover the first resinframes 25 b by, for example, potting.

In the phosphor sedimentation step, the phosphor particles contained inthe second resin layer 23 are settled towards the baseplate 20 side byrotating the second resin layer 23 together with the baseplate 20 aroundthe axis of rotation which is in parallel with the baseplate 20 andlocated above the second resin layer 23 opposite the baseplate 20. forexample.

In the second resin layer curing step, the second resin layer 23 iscured in the state in which the phosphor particles are settled to thebaseplate 20 side. According to the light transmissive member formingstep described above, light emitting devices can be produced usingvarious phosphors.

Moreover, in the cases where the second resin layer 23 is formed to fillthe openings 25 a and cover the first resin frames 25 b as shown in FIG.7C, the light transmissive member forming step further can include aremoving step after curing the second resin layer 23. In the removingstep, as shown in FIG. 71), the second resin layer 23 is ground from theupper face, for example, so as to reduce the second resin layer 23filling the openings 25 a to a given thickness and to remove the secondresin layer 23 disposed on the first resin frames 25 b.

The light transmissive member forming step may be adapted so as to formthe second resin layer 23 of a prescribed thickness in each opening 25without forming the second resin layer 23 on the first resin frames 25 bby filling each opening 25 a with a prescribed amount of the secondresin layer 23. In this case, the removing step may not needed.

Mounting Light Emitting Element

In the manufacturing method of Embodiment 1, the light emitting elementmounting step may include a baseplate detaching step, a die bondingstep, and as needed, a reinforcing sheet attaching step before thebaseplate detaching step. The explanation below includes the reinforcingsheet attaching step.

In the reinforcing sheet attaching step, a reinforcing sheet 40 isattached to the light transmissive member 3 composed of a second resinlayer formed on the first resin frames 25 b and the openings 25 a. Thereinforcing sheet 40 strengthens the combination sheet 30 composed ofthe first resin frames 25 b and the light transmissive member 3 retainedby the first resin frames 25 b.

In the baseplate detaching step, the baseplate 20 is detached from thecombination sheet 30 reinforced by the reinforcing sheet 40. When thebaseplate 20 is detached, recesses 30 a corresponding to the protrusions21 of the baseplate 20 appear on the combination sheet 30. The bottomface of each recess 30 a includes the lower face of the lighttransmissive member 3 and the second bottom face 5 b exposed in thesurrounding of the lower face. In the surrounding of the recesses 30 a,the first bottom faces 5 a are also exposed.

In the die bonding step, as shown in FIG. 7E, a light emitting element 1is bonded to the bottom face of each recess 30 a using a die bondingresin. The die bonding resin is made of, for example, a lighttransmissive resin, and a die bonding resin layer is formed between thelight emitting element 1 and the light transmissive member 3, and theoblique portions 9 made of the die bonding resin are formed in thesurrounding of the light emitting element 1. For effective extraction oflight via the light transmissive member 3, the light emitting element 1is preferably bonded to the lower face of the light transmissive member3 without extending onto the second bottom face 5 b. The light emittingclement 1 is preferably mounted so as to be surrounded by the obliqueportions 9 made of the die bonding resin within the recess 30 a. Byforming the oblique portions 9 to allow their one end to reach thelateral walls of the recess 30 a, the oblique portions 9 can straddlethe light transmissive member 3 and the first resin frame 25 b. This canspread the oblique portions 9 across the entire lower face of the lighttransmissive member 3, enabling light to enter across substantially theentire surface of the light transmissive member 3. This can reduceluminance irregularities at the emission face.

Forming Second Reflector

In the manufacturing method of Embodiment 1, the second reflectorforming step may include a third resin forming step and a third resinlayer grinding step.

In the third resin forming step, as shown in FIG. 7F, a third resin 27containing a light reflecting substance, for example, is formed to coverthe light emitting elements 1 individually mounted in the recesses 30 aand to be in contact with the second bottom faces 5 b. It is preferableto form the third resin 27 so that the third resin fills recesses 30 ain the surrounding of the light emitting elements 1 as well ascontacting the oblique portions and the lateral walls of the recesses 30a. This can securely bond the first resin and the second resin together.

In the third resin layer grinding step, the third resin 27 is groundfrom the lower face to expose the electrodes 13 and 14 of the lightemitting elements.

Separating

In the separating step, the light emitting devices may be separated intoindividual pieces by cutting the first resin and the third resin alongthe dividing lines L1 indicated in FIG. 7G by dicing, or the like, afterdetaching the reinforcing sheet or cutting together with the reinforcingsheet.

In the manner described above, the light emitting device of Embodiment 1shown in FIGS. 1-3 can be produced.

Light Emitting Device According to Embodiment 2

The light emitting device of Embodiment 2, as shown in FIGS. 4-6,differs from the light emitting device of Embodiment 1 such that theinner circumferential faces of the first reflector 5 in contact with thelight transmissive member 3 continuously extend to the first bottom face5 a without a difference in level. The light emitting device ofEmbodiment 2 described above can more effectively extract via the lighttransmissive member 3 the light reflected by the interfaces between theoblique portions 9 made of a light transmissive resin and the secondreflector 7, further increasing the light extraction efficiency.

Light Emitting Device According to Embodiment 3

The light emitting device of Embodiment 3, as shown in FIG. 9, differsfrom the light emitting device of Embodiment 2 such that the firstreflector 5 has the first bottom face 5 a that is higher than the lowerface of the light transmissive member 3. In other words, the lateralfaces of the light transmissive member 3 are covered by both the firstreflector 5 and the second reflector 7. The light emitting device ofEmbodiment 3 described above can effectively reduce light leakage fromthe interface between the first reflector 5 and the second reflector 7because a difference in level is created between the first bottom face 5a of the first reflector 5 and the lower face of the light transmissivemember 3 which is the bonding face for the light emitting element 1 andthe light transmissive member 3.

Manufacturing Method for Light Emitting Device According to Embodiment 4

The manufacturing method for the light emitting device according toEmbodiment 4, as compared to the manufacturing method for the lightemitting device according to Embodiment 1, employs a baseplate 200having a different shape from the baseplate 20 employed in themanufacturing method of Embodiment 1 as shown in FIGS. 10A-10G. Themethod is otherwise similar to the production method of Embodiment 1.

More specifically, in the manufacturing method for the light emittingdevice of Embodiment 4, the baseplate 200 has through holes 220 whichprovide, for example, cylindrical cavities, and the through holes 220are disposed, for example, between diagonally adjacent protrusions 210a. In other words, in the baseplate 200, a plurality of rectangularprotrusions 210 a, for example, are formed in rows and columns at thebaseplate surface 210, wherein the protrusions 210 a and the throughholes 220 are alternately provided in diagonal directions in the planview.

In the manufacturing method for the light emitting device of Embodiment4 employing such a baseplate 200, when forming the first resin frames 25b 1, the through holes 220 are also filled with the first resin. Thisforms, for example, cylindrical ribs 25 r corresponding to the shape ofthe through holes 220 at the first resin frames 25 b 1. Subsequently, insimilar manner to in Embodiment 1, the baseplate 200 is detached afterforming the light transmissive members 3.

In the manufacturing method for the light emitting device of Embodiment4 described above, since the ribs 25 r are formed through the throughholes 220, the first resin frames 25 b 1 can be easily detached from thebaseplate 200 by pushing the ribs 25 r while securing the baseplate 200in place.

The light emitting device produced by the above manufacturing method ofEmbodiment 4, as shown in FIG. 11, is similar to the light emittingdevice of Embodiment 1 except that a portion of the end face 25 at ofthe rib 25 a positioned lower than the first bottom face 5 a is exposedand is substantially coplanar with the bottom face of the secondreflector 7, and has similar functional effects to those of the lightemitting device of Embodiment 1.

Now, the sectional view shown in FIG. 11 is a cross section near alateral face in order to show a portion of the rib 25 a on each side,but a cross section of the light emitting device closer to the centerthan that shown in FIG. 11 is similar to that shown in FIG. 2. The sameis true for FIGS. 10A-10G.

Materials for each member included in the light emitting devicesaccording to the embodiments will be explained below.

Light Emitting Element 1

For the light emitting element 1, a semiconductor light emittingelement, such as a light emitting diode chip, can be used. Thesemiconductor light emitting element may include a light transmittivesubstrate 12 and a semiconductor stack 11 formed thereon.

Light Transmittive Substrate 12

For the light transmittive substrate 12, for example, a lighttransmissive insulating material, such as sapphire (Al₂O₃) or spinel(MgAl₂O₄), or a semiconductor material that allows the emitted lightfrom the semiconductor stack 11 to transmit therethrough (e.g., anitride-based semiconductor material) can be used.

Semiconductor Stack 11

The semiconductor stack 11 includes, for example, plural semiconductorlayers, such as an n-type semiconductor layer, an emission layer (thatis, active layer), and a p-type semiconductor layer. The semiconductorlayers can be formed using semiconductor materials, such as group III-Vcompound semiconductors, group II-VI compound semiconductors, or thelike. More specifically, a nitride-based semiconductor material, such asan In_(X)Al_(Y)Ga_(1-X-Y)N (0≦X, 0≦Y, X+Y≦1) or the like (e.g., InN,AlN, GaN, InGaN, AlGaN, InGaAlN, or the like) can be used.

Electrodes 13 and 14

For the electrodes 13 and 14 of the light emitting element 1, a goodconductor of electricity can be used, and for example, a metal such asCu is suitable.

Light Transmissive Resin Used as Light Guiding Member

For the light transmissive resin, particularly, thermosetting lighttransmissive resins, such as silicone resins, silicone modified resins,epoxy resins, and phenol resins can be used.

Moreover, since the light transmissive resin is in contact with thelateral faces of the light emitting element 1, it may be affected by theheat generated at the light emitting element 1 when turned on. In thisregard, thermosetting resins with highly heat resistant are suited forthe light transmissive resin.

First Reflector 5 and Second Reflector 7

The first reflector 5 and the second reflector 7 can be constructed witha light reflecting resin. A light reflecting resin means a resin havinga high reflectance, for example, a reflectance of 70% or higher,relative to the light from the light emitting element.

For the light reflecting resin, for example, a light transmissive resinin which light reflecting substance is dispersed can be used. Examplesof suitable light reflecting substances include titanium oxide, silicondioxide, titanium dioxide, zirconium dioxide, potassium titanate,alumina, aluminum nitride, boron nitride, and mullite. A lightreflecting substance in granular, fibrous, or thin flake form can beused. The fibrous form is preferable as it can reduce the coefficientsof thermal expansion of the first reflector 5 and the second reflector 7thereby reducing, for example, the differences in the thermal expansioncoefficient between these and the light emitting element 1. For theresin material used as the light reflecting resin, thermosetting lighttransmissive resins, such as silicone resins, silicone modified resins,epoxy resins, and phenol resins are preferable.

Light Transmissive Member 3

For the light transmissive resin used in the light transmissive member3, thermosetting resins, such as silicone resins, silicone modifiedresins, epoxy resins, and phenol resins, and thermoplastic resins, suchas polycarbonate resins, acrylic resins, methylpentane resins, andpolynorbornene resins can be used. Particularly, silicone resins whichhave highly light resistant and highly heat resistant are suitable.

Phosphor

Phosphors that can be excited by the emitted light from the lightemitting element I are used. as the wavelength converting substanceExamples of phosphors excitable by light emits from a blue lightemitting clement or ultraviolet light emitting element includecerium-activated yttrium aluminum garnet-based phosphors (Ce:YAG);cerium-activated lutetium aluminum garnet-based phosphors (Ce:LAG);europium- and/or chromium-activated nitrogen-containing calciumaluminosilicate-based phosphors (CaO—Al₂O₁—SiO₂); europium-activatedsilicate-based phosphors ((Sr,Ba)₂SiO₄); nitride-based phosphors, suchas β-SiAlON phosphors, CASN-based phosphors, SCASN-based phosphors;KSF-based phosphors (K₂SiF₆:Mn); sulfide-based phosphors, and quantumdot phosphors. By combining these phosphors with a blue or ultravioletlight emitting element, light emitting devices of various emissioncolors (e.g., a white light emitting device) can be produced.

Several embodiments of the invention have been exemplified in theforgoing. It goes without saying, however, that the invention is notlimited to those described above, and can be any given device so long asit does not deviate from the spirit and the scope of the invention.

What is claimed is:
 1. A light emitting device comprising: a lightemitting clement having an upper face and lateral faces; a lighttransmissive member covering at least a portion of the upper face of thelight emitting element and transmitting light emitted from the lightemitting element; a first reflector covering at least a portion oflateral faces of the light transmissive member; and a second reflectorcovering the lateral faces of the light emitting element; wherein thefirst reflector includes a first bottom face and a second bottom face,wherein a plane in which the first bottom face of the first reflectorextends is different than a plane in which a lower face of the lighttransmissive member extends, where the second bottom face of the firstreflector is located inward of the first bottom face of the firstreflector, and is coplanar with the lower face of the light transmissivemember, and wherein the first bottom face of the first reflector iscovered by and in contact with the second reflector.
 2. The lightemitting device according to claim 1, wherein the first bottom face ofthe first reflector is positioned lower than the lower face of the lighttransmissive member.
 3. The light emitting device according to claim 1,wherein the first bottom face of the first reflector is positionedhigher than the lower face of the light transmissive member.
 4. Thelight emitting device according to claim 3, wherein the lateral faces ofthe light transmissive member are covered by the first reflector and thesecond reflector.
 5. The light emitting device according to claim 1,wherein the difference in level between the first bottom face and thesecond bottom face is in a range between 30 μm and 100 μm.
 6. The lightemitting device according to claim 1, wherein the light emitting elementis bonded to the light transmissive member via a bonding material. 7.The light emitting device according to claim 6, wherein the secondreflector is in contact with the bonding material.
 8. The light emittingdevice according to claim 6, the first reflector further includes athird bottom face which is substantially coplanar with a lower face ofthe second reflector.
 9. A method for manufacturing a light emittingdevice comprising: preparing a baseplate having a plate surface on whicha protrusion is disposed; forming a first resin frame having an openingon the plate surface, wherein the opening is located above theprotrusion; forming a second resin in the opening; detaching thebaseplate; bonding a light emitting element to a surface of the secondresin surface that has been exposed as a result of detaching thebaseplate; and forming a third resin that surrounds lateral faces of thelight emitting element and that covers and contacts a portion of thefirst resin frame.
 10. The method for manufacturing a light emittingdevice according to claim 9, wherein: the step of forming the firstresin frame includes: placing a mold having a mold protrusion so as tobring an upper face of the mold protrusion into contact with an upperface of the protrusion of the baseplate, thereby forming a cavity thatsurrounds the protrusion of the baseplate and the mold protrusion of themold, and filling said cavity with a resin.
 11. The method formanufacturing a light emitting device according to claim 9, wherein: thestep of forming the first resin frame includes: forming a first resinlayer on the plate surface, and forming an opening in the first resinlayer.
 12. The method for manufacturing a light emitting deviceaccording to claim 9, wherein: the second resin contains phosphorparticles, and the step of forming the second resin includes settlingsaid phosphor particles near the baseplate side, followed by curing thesecond resin.
 13. The method for manufacturing a light emitting deviceaccording to claim 12, wherein the phosphor particles are settled bycentrifugation.
 14. The method for manufacturing a light emitting deviceaccording to claim 9, wherein: the step of forming the second resinincludes curing the second resin, and the method further comprisesgrinding an upper face of the second resin subsequent to curing thesecond resin and prior to detaching the baseplate.
 15. The method formanufacturing a light emitting device according to claim 9, furthercomprising attaching a reinforcing sheet across an upper face of thesecond resin and an upper face of the first resin frame prior todetaching the baseplate.
 16. The method for manufacturing a lightemitting device according to claim 9, wherein: the light emittingelement has electrodes on the face opposite to the light transmissivemember, and the method further comprises exposing the electrodes of thelight emitting element from the third resin subsequent to the formingthe third resin.